Elkhart, IN – February 4, 2013 – CTS Electronic Components, Incorporated (NYSE: CTS)
announces a full line of heat sink products that are convenient and easy to use, while maintaining
an exceptional thermal performance. These heat sinks are applicable
for BGA, PGA, PLCC, QFP and other IC packages.
Forged Heat Sink Series is a set of low profile, thin fin heat sinks. Its
height ranges from 6.3mm to 32.6mm with thermal resistance as low
as 1.9°C/Watt @ 200 LFPM convection flow conditions. These heat